90MM BGA Reballing Station Dual Direction Position self-locking BGA Stencils Fixture Jig for bga solder rework station reballing machine

Applicable maximum BGA: 45 X 45 mm
Apply to the smallest BGA: 10 X 10 mm
Body size : 90 * 90 * 32mm
Base size : 100 * 100 mm
Height : 80 mm
Exhibition handle long : 196 mm
Weight : 900 gram
Stencil Dimensions : 89.5 * 89.5 mm
Steel mesh size : 81 * 81 mm

Features :
1 , the cover has a ball inside the storage room , into the structure so that excess solder balls do not always
have to pour out , but stored in the structure , improve production efficiency
2 , cover with a ball pouring slot inside the cover of the structure to facilitate the pouring of excess solder balls
3 , four height adjusting screws , depending on the thickness of the IC can be adjusted on the support
surface and the slide cover positioned steel bumping interconnection distance , for different thickness of
the base IC bumping
4 , double screw drive supports synchronous slider moves ( relocation or within the same time -shift ) ,
to facilitate the positioning of different sizes IC
5 , the four corners of the supporting IC can hold the slider , a smooth diagonal positioning than bumping
improved efficiency